A new 360 Mobiles smartphone model was recently spotted on benchmark app GeekBench database. The device was listed with the model number 1809-A01 and runs the yet to be announced Qualcomm Snapdragon 670 chipset. The Snapdragon 670 had earlier been benchmarked on GeekBench with a single core test score of 1844 and multi-core score of 5689 points.
According to leaked details, the Snapdragon 670 will be a 10nm chipset that will not be based on the classic big.LITTLE architecture. Instead of four low-end and four high-end CPU cores, the Snapdragon 670 will be featuring a combination of low-end hexa-core processor and dual-core high-end processor. The low-end cores called Kryo 300 Silver will deliver a maximum clocking speed of 2.6 GHz.
In this case, the 360 Mobiles model scored 1889 points on the single-core test and 5938 points on the multi-core test. The device is also listed as having 6GB of RAM onboard and runs Android 8.1 Oreo OS out of the box. Since the chipset listed as SDM 670 is yet to be released, the device may be a long way from becoming official.