Redmi, the sub-brand of Xiaomi which is now working independently, has been confirmed to be working on a flagship smartphone powered by the Qualcomm Snapdragon 855 octa-core 7nm processor.
However, there are a lot of contradicting leaks and rumors surrounding the upcoming flagship smartphone. But, Lu Weibing, President of Redmi is quite active on social media and has been teasing the phone’s features.
He has now confirmed through Weibo that the phone will come with an ultra-wide camera sensor. Earlier, it was revealed that the smartphone will have a triple camera setup on the back, consisting of a 48 MP + 13 MP + 8 MP sensors — same as the Mi 9 SE.
It has also been said that the upcoming Redmi flagship will come with support for a 3.5mm headphone jack as well as NFC. Previously leaked information suggests that the phone will feature a 6.3-inch display with 2340 x 1080 pixels screen resolution.
Under the hood, it is powered by the Qualcomm Snapdragon 855 octa-core SoC with up to 8 GB of RAM and 256 GB of internal storage. It is expected to come with a 32 MP front-facing snapper for taking selfies and video calling.
In the software department, we expect the smartphone to come pre-installed with the Android 9 Pie operating system based MIUI 10. It will also come with support for some sort of fast charging but battery capacity is not yet known.
As for the name, there were leaked about the phone being named Redmi X. But Redmi president Lu Weibing recently confirmed that it’s not Redmi X and the phone will have a better name.
This suggests that the Redmi X is some kind of an internal name or the name of another smartphone which is powered by the Snapdragon 730 chipset. Manu Kumar Jain, Xiaomi India MD and Global VP recently teased this smartphone for the India launch, but nothing much is know at this time.
(Via)
