Honor will be launching the Honor 30S in China on March 30 as planned. Ever since the launch date was announced, the brand has been teasing the design and certain specs of the handset on Weibo. Now, a new set of teasers reveal the phone’s front, side, and back in full glory.
Glory Cheung, Strategy and Cheif Brand Officer of Honor has shared three teaser renders of the upcoming Honor 30S since March 26. The first teaser poster reveals the back of the device, which houses a quad-camera setup at the top left corner. The cameras are arranged in a rectangular block in a symmetrical manner with 3 sensors on one side separated by a line with a single sensor, LED flash as well as AI branding on the other side. Further, the rear panel of the device features a gradient design inspired by the wings of butterflies as per the brand executive.
The second teaser poster shows us the right side of Honor 30S housing volume rockers and power key with an integrated fingerprint sensor. Additionally, this render also gives us an idea about the bump of the camera array, which interestingly looks to be slimmer than the competition even though the phone is tipped to feature a custom large primary sensor with 64 megapixels.
Finally, the latest teaser shared today gives us the first-ever clear glimpse of the device’s front. This confirms the forthcoming Honor 30S to sport a punch-hole display, which was somewhat visible in the teaser for 40W fast charging support posted by the brand yesterday. Also, the punch-hole sits at the top left corner and seems to be smaller than other mid-range smartphones.
All the teasers posted by Honor’s Zhang Xiaoyun flaunted the Honor 30S in Green color, which was leaked a couple of days back. Apart from this color, the handset is also expected to arrive in Blue and Orange gradients. Anyway, the biggest star of this smartphone will be the new HiSilicon Kirin 820 5G chipset, which has been confirmed to outperform Qualcomm Snapdragon 765G and HiSilicon Kirin 980.
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