TSMC is currently manufacturing Apple’s A14 Bionic chipset based on the 5nm node. However, the company is set to move the 3nm node to mass production in a couple of years and is set to increase production capacity.
As per the reports coming from China, the monthly output for the 3nm node from TSMC is expected to reach 100,000 wafers in 2023. Prior to that, the Taiwanese company is set to increase its chip production capacity to 55,000 wafers by H2 2020.
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Earlier, we had reported that TSMC had to delay the 3nm process’ trial production to 2021 and mass production to 2022. Although the exact date for the risk production and trial phase is unknown, the company will announce the timeline by the end of this year.
The upcoming 3nm process will bring a number of improvements over the new 5nm chips. It will feature a 15 percent greater transistor density, along with a performance increase of 10 to 15 percent, and even raise energy efficiency by 20 to even 25 percent.
As per the reports, the company is on schedule to manufacture Apple A16 chipset using the 3nm process, which is set to arrive in 2022. On the other hand, its rival Samsung Electronics is also working on a 3nm process and is expected to start mass production in a couple of years.
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