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Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 series is expected to adopt a dual-chip strategy for the 2026 flagship smartphone cycle. According to a report by Wccftech, the company will launch a standard version and a Pro variant. The Pro model is tipped to cost over $300, making it the most expensive mobile chip Qualcomm has ever produced.

Snapdragon 8 Elite Gen 5 benchmark score

The Pro variant will likely support LPDDR6 memory and feature the new Oryon CPU architecture. It is also expected to become Qualcomm’s first mass-produced chip built on TSMC’s 2nm process. Industry data indicates that each 2nm wafer could cost as much as $30,000, significantly raising the production cost of the chip. For smartphone brands, the chip alone could account for nearly one-third of a premium phone’s total manufacturing budget.

Although tipster Smart Chip Insider on Weibo disagrees with the $300 pricing narrative, he points out that Wccftech estimates the Snapdragon 8 Elite Gen 5 at around $280 per chip, a figure he believes is overstated by more than $80. Based on this assessment, early claims that the Snapdragon 8 Elite Gen 6 could surpass $300 next year should be treated with caution.

Anyway, due to the high cost, the Snapdragon 8 Elite Gen 6 Pro might only appear in Ultra flagships. Mainstream flagship devices are expected to adopt the standard Snapdragon 8 Elite Gen 6 instead. This version will feature a 2+3+3 CPU cluster, retain support for LPDDR5X RAM, and offer a more power-efficient GPU. It will not support LPDDR6 memory but is expected to deliver stable high-end performance.

The ongoing DRAM pricing crisis is also influencing chipset choices. Rising memory costs are increasing the overall bill of materials for smartphones. To keep retail prices in check, many manufacturers may avoid the Pro chip and opt for the standard version to maintain a better balance between performance and cost.

High-end chips have faced criticism for overheating and poor battery efficiency. The standard Snapdragon 8 Elite Gen 6 may provide better sustained performance and thermal management, making it a more practical solution for mass-market flagship phones in 2026.

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(Via)

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