Chinese tech blog Aio Technology posted a teardown of Huawei’s Mate 40 Pro last week showing the internals of the device. As a follow-up, the teardown of the classy Mate 40 RS Porsche Design Edition which packs a self-developed HiSilicon storage chip inside has been posted online.
The short disassembly video starts teardown starts predictably by heating up the back of the device and using a suction cup to pry it open. Aside from the exclusive octagon-shaped rear design, the Mate 40 RS is nearly identical in design to the Mate 40 Pro on the inside.
We have the five camera modules including the IR temperature sensor alongside the NFC and wireless charging coils, 4,400 mAh battery and charging module. Disconnecting several connection cables lets you remove the motherboard and camera modules.
Huawei Mate 40 RS teardown reveals self-developed memory chip
This is where the interesting bit is, we can clearly see the memory chip bears HiSilicon branding which is proof that Huawei is developing in-house memory chips. There’s not much info out there about this specific memory storage.
Huawei Mate 40 RS teardown reveals self-developed memory chip
According to reports from Chinese tech bloggers, the Mate 40 Pro+ and Mate 40 RS are the first devices to use Huawei’s self-developed SFS 1.0 flash memory which tests almost twice as fast as UFS 3.1 storage in read and write speeds.
Per the example given, Huawei’s SFS 1.0 storage manages sequential write speed at 1,280MB/s and random write speeds of 548MB/s which are notably faster than UFS 3.1 storage which hoovers around 700MB/s sequential write and 200-300MB/s random write speeds.
Huawei is yet to release an official statement regarding the SFS standard so this information may not be entirely accurate.
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