Qualcomm has taken the wraps off the Snapdragon 888 Plus processor. The new chipset was announced today at Mobile World Congress (MWC 2021) and is the manufacturer’s most powerful mobile platform yet.
The Snapdragon 888 Plus arrives as an upgraded version of the Snapdragon 888 announced about seven months ago, and which has powered flagships launched in the first half of the year. The new chipset is expected to power the flagships scheduled for H2 2021.
Qualcomm says the new 5nm chipset boasts improvements in processing and AI when compared to its predecessor.
Snapdragon 888 Plus specifications
The prime core of the Kryo 680 CPU is now clocked at 3GHz (the exact speed measured is actually 2.995GHz). That is a boost when compared to the 2.84GHz prime core clock speed of the Snapdragon 888.
The Hexagon 780 AI Engine has also received a 20% improvement in performance. The chip now delivers up to 32TOPS, an upgrade from the 26 TOPS of its predecessor.
These are the two key differences between the new chipset and the Snapdragon 888.
Snapdragon 888 Plus 5G Key Specs
- Kryo 680 CPU – up to 3.0GHz with Arm Cortex-X1 technology
- Hexagon 780
- Adreno 660 GPU
- Spectra 580 ISP
- Snapdragon X60 5G Modem (Downlink up to 7.5Gbps)
- FastConnect 6900
- Bluetooth 5.2
- Quick Charge 5
Qualcomm says we will see the Snapdragon 888 Plus in phones launching in the second half of the year. It has confirmed that some of these phones will be launched by ASUS’ ROG brand, Honor, Motorola, Vivo, and Xiaomi.
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