Recently, the WeChat account, a Chinese social media platform, of HiSilicon Recruitment shared the news that the Huawei chip unit will be starting a new wave of recruitment that will start next year.
As per the announcement, the Chinese tech giant’s chip designing unit will be recruiting students that have graduated from domestic colleges ad universities in China. This recruitment period is between the 1st of January 2022 till the end of the year, which is December 31st. The hiring would be aimed at both bachelors and masters students that are of Chinese nationality. Furthermore, this recruitment drive will be for various parts of its operations.
This includes chipsets, hardware, research, software, testing, and systems. HiSilicon also announced that the jobs will be situated in multiple locations in China including Beijing, Shanghai, Shenzhen, Dongguan, Wuhan, Xi’an, Chengdu, Hangzhou, Nanjing, and Suzhou. Previously, we had reported on Huawei HiSilicon building a new chip factory in Wuhan to offset the US sanctions the company faced.
Furthermore, the brand also announced that it would retain its workforce in its chip unit, HiSilicon, and would even push for advanced semiconductor technology as well. In other words, this recruitment plan might be a part of its future plans to become self sufficient, especially in regards to its supply chain, while also seeking to bring in local talents as well. Unfortunately, this is all the information we have at the moment, so stay tuned for more updates as we will be providing updates when additional information is available regarding this matter.
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