Huawei Technologies is apparently determined to develop cutting edge advanced semiconductors. The news arrives despite the company facing US sanctions that cut off its ability to acquire semiconductors from its primary chip supplier, TSMC.
According to a NikkeiAsia report, the Chinese tech giant is resolute in developing class leading semiconductor technology, as per Catherine Chen, a Huawei director and senior vice president. The official also added that the firm has no plans on restructuring its chip design unit, HiSilicon. In other words, the company won’t be laying off anyone from its subsidiary. At the moment, the HiSilicon had more than 7,000 workers back in 2020. This sizeable number would likely be hard to maintain considering the unit is expected to be unable to contribute to the company’s earnings for what could be years.
Although, Chen stated that the company is privately held and is unaffected by external forces, while its management has indicated that it intends to retain HiSilicon despite the US sanctions. The chip designing unit was founded back in 2004 and is considered one of the most advanced chip developers in the world, also known for making the Kirin lineup of processors for Huawei’s smartphones.
In the first quarter of this year, the unit brought in 385 million US Dollars in sale, which marked a sizeable drop of 87 percent from the firm’s highest ever sales from back in Q2 2020. Chen further added that the company will not reduce HiSilicon’s workforce and will continue to develop semiconductors and will manage despite the sanctions that are expected to remain for two to three years. the company would also be promoting their own semiconductor industries and will help HiSilicon gain new supply chain partners that do not rely on US technology.
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