Chinese smartphone maker Coolpad is expected to release the COOL 20 Pro smartphone on December 1. The company had earlier released a teaser poster which gave us a look at the design of the sleek smartphone. The company has now released yet another teaser poster which confirms the device will be powered by the MediaTek Dimensity 900 5G chipset.
MediaTek first unveiled the Dimensity 900 5G SoC in May this year. The chip is built using 6nm process technology and it can deliver a smooth and silky high frame rate gaming experience. The chipset had earlier been spotted when a device believed to be the COOL 20 Pro appeared on GeekBench and also received TENAA certification.
The Cool 20 Pro had earlier been tipped to pack a 50-megapixel AI triple camera and use the ArcSoft image algorithm. The earlier renders also show the device will be available in three color variants – black, white, and blue. In addition, the COOL 20 Pro will use the AG glass back shell, which is delicate and tough and won’t collect fingerprints or smudge.
The earlier teasers also show the COOL 20 Pro will be equipped with symmetrical dual speakers and support dual 5G and WiFi 6 networks. It will also have support for a 120Hz refresh rate with the ability to automatically switch between refresh rates intelligently in order to conserve the battery power.
The TENAA listing shows the Cool 20 Pro will pack a 6.58-inch FHD+ resolution LCD screen with a waterdrop notch. The device is also revealed to pack a 4400mAh battery while also retaining the 3.5mm headphone jack.
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(via)
