Overheating of chips is an important part of their production process and chip makers continue to seek ways of keeping their chips cool while not affecting overall performance. There are reports that three top-of-the-line chips which will be debuting in some of this year’s flagship smartphones could be having overheating problems. The chips are the Qualcomm Snapdragon 8 Gen 1, Samsung’s Exynos 2200, and MediaTek’s Dimensity 9000, which are all top-end super-functional chips of their various manufacturers.
Taiwanese company TSMC is the producer of the Dimensity 9000 while Samsung Foundry assembled both the Exynos 2200 and the Snapdragon 8 Gen 1. All three chips are produced using the 4nm node process and there had been some tweets by a few tipsters pointing to the presence of the overheating problem in these top-end chips. The leaks related to the Snapdragon 8 Gen 1 which was observed to overheat when put through the paces in the Motorola Edge X30, one of the few models sporting the flagship chip.
Tested the new A510 small cores in #Snapdragon8Gen1
Compared to the A55 in SD888:
Performance +15%
Power consumption +69%
Efficiency -33%
A710 and A510 are really not looking good 😭😭😭 https://t.co/6ttZ8bOIVP pic.twitter.com/TuVFiE0Dce— Golden Reviewer (@Golden_Reviewer) December 25, 2021
TSMC has a superior 4nm process than Samsung Foundry, hence the Dimensity 9000 could perform better and experience less overheating than the other two chips. Although the views by the tipsters are not definitive, it remains to be seen how the demand for these high-end chips pans out this year. The global chip shortage is still projected to persist beyond the first half of 2022.
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(via)
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