Redmi is expected to unveil the Redmi K50 series as early as this month. Ahead of that, the smartphones in the lineup have started getting necessary certifications. Three models have now made their appearance on TENAA.
According to Digital Chat Station, three Redmi K50 series phones have been certified by TENAA. These devices bear model numbers 22021211RC, 22041211AC, and 22011211C respectively.
The tipster says that these handsets are powered by MediaTek Dimensity 9000 chipset. Qualcomm Snapdragon 870 SoC, and unannounced MediaTek Dimensity 8000 chip. However, he specifically doesn’t mention the silicon associated with the aforementioned models.
According to earlier reports, the Redmi K50 series smartphone with model number 22021211RC will be powered by a Snapdragon 870 chipset. Further, the one with model number 22041211AC was previously said to house a yet-to-release Dimensity 7000 chip. For the unaware, this SoC is now rumored as Dimensity 8000.
Lastly, the phone with model number 22011211C was earlier reported to feature a Qualcomm Snapdragon 8 Gen 1 silicon. However, Digital Chat Station does not list this chipset in his post. Instead, he mentioned Dimensity 9000. Hence, this particular device could come powered by the latest flagship chip from MediaTek, rather than Qualcomm.
We expect these handsets to get more certifications in the coming days. At the same, we are also looking forward to the official teasers from Redmi. In other words, like any other recent smartphone from the Xiaomi group, we expect to learn almost everything about the Redmi K50 family before it goes official.
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