At the MWC 2022, MediaTek has unveiled the Dimensity 8100 and Dimensity 8000 chipsets. A couple of smartphone OEMs from China such as Redmi, Realme, Vivo, and OnePlus are said to be working on Dimensity 8100 powered smartphones. Today, Realme China’s CMO Xu Qi confirmed that the upcoming Realme GT Neo3 will be equipped with D8100 SoC.
The machine-translated text of Xu Qi’s Weibo post reads, “Realme will be the first to carry the Dimensity 8100 chip.” This indicates that the GT Neo3 may debut as the world’s first smartphone powered by the D8100 chip. The 5nm chip has 4 x Cortex-A78 CPU cores working a 2.85GHz, 4 x Cortex-A55 CPU, Mali G-610 MC6 GPU, LPPDR5, UFS 3.1 storage, sub-6GHz 5G, Wi-Fi 6E, Bluetooth 5.3, and up to 200MP camera.
The Realme GT Neo3 is also confirmed to carry support for 150W UltraDart charging. The performance of the D8100 is said to be on par with the Snapdragon 888. Hence, the GT Neo3 is expected to offer an impressive gaming experience.
The GT Neo3 is expected to arrive in two battery variants. The model that will carry support for 150W UltraDart charging is likely to pack a 4,500mAh dual-cell battery. The other variant that is expected to support 80W fast charging may house a 5,000mAh dual-cell battery. The other specs are likely to remain same on both models.
The smartphone will come equipped with a 6.7-inch OLED display with a central punch-hole The screen will offer a Full HD+ resolution and a 120Hz refresh rate. The device will be equipped with up o 12 GB of RAM and up to 256 GB of native storage.
For photography, it will feature a 16-megapixel front camera and a 50-megapixel (main, with OIS) + 8-megapixel + 2-megapixel triple camera unit. It will come with other features such as Realme UI 3.0 flavoured Android 12 OS and an in-screen fingerprint scanner.
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