Samsung had just announced its latest GDDR6 memory chips that is set to offer a number of improvements over its predecessors. These upgrades will seek to meet needs of massive memory and increased computing power scenarios.
As per official notes, the South Korean tech giant has unveiled the “industry’s first next-generation graphics DRAM technology.” This offers major improvements over traditional GDDR6 memory products by offering an additional DRAM device to basically double the capacity and bandwidth without bringing any of the possible impacts that might be faced with the larger form factor. Samsung has stated that the new GDDR6W will bring all of these improvements while still having the same energy consumption as the regular GDDR6.
Furthermore, the new chips will also allow customers to use the new technology without having any major change in existing hardware. The new Samsung GDDR6W features a new technology that the brand calls FOWLP or Fan Out Wafer Level Packaging. The new packaging process helps offer a more compact design with finer writing patterns. This allows for a packaging that has a reduced typical thickness from 1.1mm to 0.7mm.
According to CheolMin Park, Vice President of New Business Planning, Samsung Electronics Memory Business, “With GDDR6W, we’re able to foster differentiated memory products that can satisfy various customer needs – a major step towards securing our leadership in the market.” The company hopes that the new GDDR6W memory will enable better performance for AI and high performance computing accelerators. Although, this will also be announced on small forfactor devices like notebooks as well.
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