Like Apple and Samsung, Huawei also used to develop its own chipsets. The majority of the smartphones from the Chinese OEM featured a Kirin SoC, developed by HiSilicon – a Huawei-owned fabless semiconductor company based in China. But since 2021, the brand has been relying on processors designed by Qualcomm. Now, a tipster claims the Chinese behemoth has a surprise chipset in the works that will be unveiled in the second half of this year. Here are the details.
A reputed Chinese tipster claims that Huawei is planning to bounce back in 2023 and in order to do so, it will be dropping small surprises. One, for instance, will be a chipset designed using a new packaging technology. To make you understand, a chip’s packaging plays a critical role in its performance as it is the physical interface between the processor and motherboard.
To maintain confidentiality, the tipster did not reveal any other detail about the surprise Huawei chipset. However, he hinted that the new chip will be debuting in the second half of this year. He didn’t specify if it will be a Kirin chip or something entirely new.
A new processor may improve Huawei’s position in the global market. The company’s smartphone sales have been going downhill since the US trade ban and it’s trying hard to stay relevant in the market. You might be aware that Huawei smartphones cannot support 5G as well as Google services.
Things don’t appear to be easing off for Huawei as the US recently secured a deal with Netherlands and Japan to tighten access to chipset manufacturing technologies for China. The US is apparently planning to cut off Huawei Technologies from all of its suppliers, including Intel and Qualcomm.
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