MediaTek, a leading semiconductor company, has partnered with Xiaomi to introduce the Dimensity 8200-Ultra mobile platform. This collaboration aims to deliver a high-performance chip that excels in imaging capabilities. Xiaomi’s official Weibo account has confirmed that the first smartphone to feature the Dimensity 8200-Ultra will be the Xiaomi Civi 3.
The Dimensity 8200-Ultra, fabricated on TSMC’s cutting-edge 4nm process, boasts 4 Cortex A78 cores and 4 Cortex A55 cores, resulting in a powerful chipset that achieves an impressive Antutu benchmark score surpassing 900,000 points.
Xiaomi Civi 3’s custom Dimensity 8200-Ultra will focus more on better image processing
The collaboration between MediaTek and Xiaomi leverages the strengths of both companies to optimize the Dimensity 8200-Ultra’s imaging capabilities. Xiaomi is renowned for its expertise in algorithms and imaging technology, as demonstrated by its achievements in various technical aspects of photography. MediaTek, on the other hand, brings its extensive experience and technological expertise to the mobile imaging field.
The Dimensity open architecture facilitates seamless integration between MediaTek’s platform and Xiaomi’s imaging capabilities. Xiaomi’s Imaging Brain, powered by advanced algorithms, has achieved industry recognition and success in areas such as portrait photography, snapshot capturing, and night scenes. To ensure compatibility and efficiency, Xiaomi has created a cross-platform intermediate layer that enables easy adaptation of the Imaging Brain to the Dimensity mobile platform, streamlining the adaptation process for future updates.
The collaboration also focuses on operator implementation acceleration, which involves enhancing and accelerating more than 30 operators of Xiaomi’s Imaging Brain on the Dimensity 8200-Ultra. This optimization allows Xiaomi’s Imaging Brain to leverage the full potential of the chip, resulting in excellent image processing effects, improved performance, and enhanced power efficiency. The integration of Xiaomi’s Imaging Brain framework brings 38 imaging functions to the Dimensity mobile platform for the first time, delivering optimized speed and power consumption compared to previous devices, with a notable 235% increase in burst speed.
Chen Junhong, Vice General Manager of MediaTek’s Wireless Communication Business Unit, expressed his excitement about the upcoming smartphone, stating that it will amaze consumers with its sleek design, impressive performance, and exceptional imaging capabilities.
By collaborating closely with global smartphone brands like Xiaomi, MediaTek aims to unlock the full potential of its Dimensity platform and deliver extraordinary user experiences tailored to specific market segments.
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