The upcoming Google Pixel 8 series is scheduled for release on October 4th as part of the annual ‘Made by Google’ event. As is customary, most of the specifications and features of these smartphones have already been disclosed through leaks. While the Pixel 8 currently appears to lack any major upgrades beyond some noteworthy software features, a recent report has piqued our curiosity about this upcoming smartphone.
As per a recent tweet by Revegnus, the new Tensor G3 chip inside the Pixel 8 series will incorporate FO-WLP (Fan-out wafer-level packaging) packaging, which is expected to reduce heat generation and increase power efficiency. Companies like Qualcomm and MediaTek already use this technology to improve efficiency, and graphics performance and help keep their chips cooler. This will be the first time that Samsung Foundaries, who make the Tensor G3 chips for Google will be implementing this tech.
Although the Tensor G3 may not set any performance records, its potential to run at lower temperatures compared to the G2 could become a significant selling point for the Pixel 8 series. This is especially relevant since the Pixel 7 has faced challenges in maintaining acceptable temperature levels during both demanding and routine tasks.
However, there are rumors suggesting that Google intends to break free from its reliance on Samsung. Reports have surfaced, indicating that the company is contemplating the complete in-house design and manufacturing of its chips, potentially utilizing TSMC‘s 4nm process.
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