Update: The Dimensity 8300 is confirmed to launch on November 21

Original story continues…

Qualcomm and MediaTek have recently unveiled their latest flagship processors, namely the Snapdragon 8 Gen 3 and Dimensity 9300. Both companies are reportedly gearing up to announce sub-flagship chipsets like the Snapdragon 7 Gen 3 and Dimensity 8300 shortly, according to a recent leak. 

Snapdragon 7 Gen 3, Dimensity 8300 launch timeframe

Snapdragon 7s gen 2
Snapdragon 7s gen 2

According to tipster WHY LAB, both chipsets will debut in the next two weeks. The Snapdragon 7 Gen 3 chip is expected to debut first, followed by the Dimensity 8300 chip.

It is speculated that the Honor 100 debuting on Nov. 23 in China will be the first phone to feature the Snapdragon 7 Gen 3 chip. The same chip is expected to power other smartphones, such as the Vivo S18, Vivo V30, and OnePlus Ace 3 (global name: OnePlus Nord 4). On the other hand, the Redmi K70e appears to be an ideal candidate to feature the Dimensity 8300 chipset. The K70 series, which also includes the K70 and K70 Pro, is expected to debut by the end of this month in China.

As per reports, the Snapdragon 7 Gen 3 is equipped with a high-performance core running at 2.63GHz, three performance cores operating at 2.40GHz, and four efficiency cores clocked at 1.80GHz. Additionally, it is equipped with an Adreno 720 GPU.

As far as the Dimensity 8300 chipset is concerned, it is speculated to include one Cortex-X3 super-large core clocked at 2.8GHz, accompanied by three Cortex-A715 performance cores running at 2.4GHz, and four Cortex-A510 efficiency cores operating at 1.6GHz. In terms of graphics, the Dimensity 8300 integrates a G520 MC6 GPU with a frequency of 850MHz.

The SD7G3 and D8300 are said to be manufactured on TSMC’s 4nm process, which means these chips will offer top-notch performance and better power efficiency on sub-flagship phones. 

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