After Dimensity 9300, MediaTek is gearing up to unveil its latest smartphone chipset, the Dimensity 8300, on November 21. Details about the chipset have been trickling out in recent weeks, and now renowned tipster Digital Chat Station has provided a comprehensive overview of the key specifications.
MediaTek Dimensity 8300 Specs (Rumored)
According to the tipster, the Dimensity 8300 is built on TSMC’s 4nm manufacturing process. And, the core CPU configuration comprises a single high-performance Cortex-A715 core clocked at 3.35GHz, three additional Cortex-A715 performance cores running at 3.32GHz, and four power-efficient Cortex-A510 cores operating at 2.2GHz. The graphics are handled by a Mali-G615 MC6 GPU.
The 4+4 core architecture is similar to that of the Dimensity 8200 chipset. Here, the four Cortex-A715 cores will handle most of the performance-intensive tasks and four Cortex-A510 cores will focus on efficiency-related things.
The Dimensity 8300 has also been spotted in a Geekbench 6 listing on a Redmi phone, believed to be part of the upcoming K70 series.
The phone, identified with the model number Xiaomi 2311DRK48C, achieved a single-core score of 1512 and a multi-core score of 4886. This performance puts it slightly ahead of the Dimensity 8200 and 8200-Ultra chipsets.
According to leaker Digital Chat Station, the Dimensity 8300’s performance is expected to surpass that of the Qualcomm Snapdragon 7+ Gen 2 SoC.
Further details regarding the Dimensity 8300’s capabilities and performance will be available upon its official launch on November 21st.
Related:
- MediaTek Dimensity 9300 benchmark results are here, and they’re very impressive
- Snapdragon 7 Gen 3 expected to launch in next two weeks
- Realme GT Neo 6 with Snapdragon 8 Gen 2 could be in works, price range tipped
- IDC Q3 2023 report: Realme, Poco, OnePlus, and Infinix shine in Indian smartphone market
(Via)
