Two new Wi-Fi 7 chips have been announced by MediaTek. They are the Filogic 360 and Filogic 860. The Filogic 860 is a standalone model while the Filogic 360 is designed for use in smartphones, laptops, and other tech devices.
The new MediaTek Filogic series Wi-Fi 7-ready chips were showcased earlier during CES 2023. The MediaTek Filogic 360 is a reduced version of the Filogic 380 which was released earlier in 2023. It is tailor-made for smartphones, tablets, laptops, routers, and various IoT devices. The chip is capable of the basic functionality of Wi-Fi 7 including multi-user, multiple input, multiple output (MU-MIMO), 4096 QAM, and download speeds up to 2.9Gbps. It also offers dual Bluetooth 5.4 connectivity and LE audio support.
The Filogic 860 chip has a 3-core CPU and is a scaled-down version of the MediaTek Filogic 880. It offers automatic frequency coordination, 160Hz channel bandwidth, and 4096 Quadrature Amplitude Modulation (QAM) scheme. The maximum throughput of the Filogic 860 is 7.2Gbps. It supports up to 10Gbps single Ethernet connections, 1 x 2.5Gbps, and 4 x 1 Gbps connections. The MediaTek Filogic 860 chip can be configured with PCIe Gen 3 host controllers for embedded usage. The model can also accommodate USB 3.2 ports if so desired for manufacture by wireless router makers. The MediaTek Filogic 860 has a CPU with 3x Cortex-A78 cores with a peak of 1.8GHz. There is also an NPU that assists the CPU with resource-heavy tasks.
MediaTek says devices featuring the new Wi-Fi 7 chips are already being mass-produced and will be available in mid-2024. The premium features of the MediaTek Filogic 360 and Filogic 860 Wi-Fi 7 chips could make them highly sought after.
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