MediaTek‘s been busy lately, launching their new flagship Dimensity 9300 SoC earlier this month. And now they’re back with another announcement, the Dimensity 8300. This new chip is designed for mid-range smartphones, but it packs a serious punch, offering significant improvements in performance, efficiency, and AI capabilities.

MediaTek Dimensity 8300 SoC launched

MediaTek Dimensity 8300 Overview

Built on a second-generation TSMC 4nm process, the Dimensity 8300 delivers significant performance and efficiency improvements over its predecessor. 

The chip is built on a 4nm process and has a triple-tier CPU architecture with one Cortex-A715 core clocked at 3.35GHz, three Cortex-A715 cores clocked at 3GHz, and four Cortex-A510 cores clocked at 2.2GHz. This configuration promises a 20% performance boost and up to 30% better efficiency compared to the Dimensity 8200.

The graphics capabilities have also received a major upgrade, with the Mali-G615 MC6 GPU offering a claimed 60% performance boost and a 55% efficiency gain. That means you can expect smooth and responsive gaming experiences on devices powered by this chipset.

The Dimensity 8300 also brings several improvements to the camera department, including support for 4K/60fps HDR video, more power-efficient video recording, and AI-Color functionality for enhanced image quality.

An interesting feature of the Dimensity 8300 is the APU 780 AI silicon, which supports large language models (LLMs) with up to 10 billion parameters. This enables features like real-time language translation, text summarization, and even creative writing.

Other notable features of the Dimensity 8300 include AV1 decoding, Bluetooth 5.4, Wi-Fi 6E, and support for refresh rates of up to 120Hz at WQHD+ resolutions (or 180Hz at FHD+).

The first smartphone powered by the Dimensity 8300 will be the Redmi K70e, which is likely to launch later this month.

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