The upcoming next-generation System-on-Chips (SoCs) from Qualcomm and MediaTek are expected to be the world’s first 3nm SoCs. Although their official announcements are still far away, leaks have begun surfacing, providing a glimpse into what these chips might offer. 

A well-known source, Digital Chat Station, suggests that MediaTek’s Dimensity 9400 SoC could outperform Qualcomm in all aspects.

According to the tipster, the Dimensity 9400 will differ from its predecessor, the Dimensity 9300, as it won’t feature four Cortex-X5 performance cores. 

It will still maintain a configuration with performance cores throughout, omitting the inclusion of efficiency cores. However, the company might be looking to decrease the X-core count on their next SoC. 

The lack of an efficiency core may raise concerns about the processor’s efficiency, but the 3nm manufacturing process is expected to enhance thermal efficiency due to improved fabrication.

MediaTek Dimensity 9400(1)

Details regarding the GPU of the upcoming SoC are currently unavailable. As a result, the tipster might be focusing solely on comparing the CPU performance of the Dimensity 9400 with Qualcomm’s Snapdragon 8 Gen 4.

Moreover, Vivo is also expected to play a significant role in the development of the MediaTek Dimensity 9400 chip. A previous report suggests that Vivo is actively involved in this chip’s development, building on their collaboration with MediaTek on the Dimensity 9300, particularly in the AI domain. 

While much remains unknown about the Dimensity 9400 and its performance, it is certain that Qualcomm is also working hard on its first 3nm mobile processor, the Snapdragon 8 Gen 4. We will be sure to keep an eye on it.

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