Taiwanese chipmaker MediaTek held a ceremony on January 30th to mark the start of construction for a new office building near the Hsinchu High-speed Railway station. The 22-story building is expected to accommodate 3,000 employees by 2027.

During the event, CEO Cai Lixing mentioned the upcoming Dimensity 9400 chip (though not specifically referred to) will arrive in the fourth quarter of 2024. According to Cai, the new SoC will boast improved AI capabilities, aiming to compete with other high-end smartphone processors.

MediaTek Dimensity 9400(1)

Even though we don’t know all the details about its performance, a report by China Times spilled some beans about the Dimensity 9400. 

The leak includes a table detailing potential upgrades for the upcoming SoC, which unsurprisingly mentions the use of TSMC’s 3nm process. The switch from 4nm to 3nm should result in improved performance and power efficiency compared to its predecessor, the Dimensity 9300.

Moreover, unlike Qualcomm, which is transitioning to its custom Oryon CPU cores, MediaTek will likely stick with Arm’s CPU designs and will upgrade to the Cortex-X5 for its main core. Besides this, the Dimensity 9400 will have three Cortex-X4 and four Cortex-A720 performance cores. 

The leaked details also suggest that the Dimensity 9400 will be able to process 12 to 15 tokens (most basic units of a text for an LLM) per second using a specific model called Llama 2 from Meta. 

Additionally, for image creation using Stable Diffusion 1.5, the Dimensity 9400 is expected to be faster than the 9300, taking only 3 seconds compared to 3.5 seconds.

This improvement will make the Dimensity 9400, and its APU 790 successor, potentially 20-50% faster for processing tokens and up to 16.7% faster for image creation. 

These are still early details about the MediaTek Dimensity 9400, so we suggest you take this information with a pinch of salt.

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