Qualcomm‘s next flagship mobile processor, the Snapdragon 8 Gen 4, is expected to launch later this year, and rumors regarding its features are picking up steam. A new leak by Weibo tipster Digital Chat Station has shed light on upgrades for the upcoming SoC’s graphics processing unit (GPU).
The tipster suggests that the 8 Gen 4 will utilize an upgraded GPU architecture with improved cache and memory compression technology. The architecture in question is called “Slice GPU architecture” according to a source on X (formerly Twitter) which goes by the handle name sun.dtsi.
The source explains that in Slice architecture, the GPU is divided into multiple independent physical units called “slices.” Each slice has its own pipeline, cache, and memory.
Digital Chat Station also mentioned that Qualcomm has developed a “new technology” to improve “GPU utilization” that will ultimately deliver better performance. According to the X source, the technology referred to by the tipster is called “Dynamic Wave Pairing” for which Qualcomm filed a patent in 2022.
According to the patent’s abstract, Dynamic Wave Pairing will allow the GPU to distribute tasks more efficiently. The GPU can assign workloads to different sections within itself, and then choose the most suitable one to handle that specific task. It will ensure that the GPU is constantly working at its optimal capacity leading to smoother performance.
Qualcomm’s custom Oryon CPU cores are also expected to bring significant performance gains. A report earlier this month revealed that 8 Gen 4’s high-performance core reaches a clock speed of 4.2GHz, with benchmark scores of 3,000 points in single-core and 10,000 points in multi-core on Geekbench.
All the leaked details so far suggest that the Qualcomm Snapdragon 8 Gen 4 will be a powerful SoC that will give tough competition to MediaTek’s Dimensity 9400 and Samsung’s Exynos 2500.
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