Xiaomi is working on two foldable phones, such as the Xiaomi Mix Fold 4 and the Mix Flip for the Chinese market. The Mix Fold 4 may launch in the coming month (July) as it has already received approval from China’s 3C certification platform. The Mix Flip may likely go official alongside the Mix Fold 4 as it was spotted at the 3C certification last month. A new leak, courtesy of tipster Digital Chat Station, sheds key information about the upcoming Mix Flip.
Xiaomi Mix Flip design, key details emerge
According to DCS, the Xiaomi Mix Flip will feature a large-sized cover display, allowing for screen rotation that accommodates both left- and right-handed users. It will be powered by the Snapdragon 8 Gen 3 chipset, which is currently the most powerful on the market. This chipset will deliver a performance boost of approximately 50 percent compared to the other flip-style foldable phone, with AI capabilities that are significantly advanced.
Shown above is a schematic of the Mix Flip shared by DCS. Its cover display is quite big and could be around 4 inches like the Honor Magic V Flip’s cover screen. In addition, it has dual rings, with the top featuring an LED flash and a camera. The second ring houses the second rear-facing camera. Additionally, it will be the only foldable phone to feature an external earpiece, enhancing its functionality.
In terms of photography, the Mix Flip will be a standout within the foldable phone category, offering superior camera performance. According to previous reports, the device will feature a 50-megapixel main camera with OIS support and a 60-megapixel OmniVision OV60A telephoto camera with 2x optical zoom. While there is no clarity about its battery size, it is expected to support 67W fast charging.
The release schedule for the Xiaomi Mix Flip has been moved up, so it will be available sooner than initially expected, which still suggests that it may break cover in July.
(source)
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