MediaTek‘s upcoming flagship SoC, the Dimensity 9400, has been a hot topic in the rumor mills for months now. However, it might not be the only high-end chip the company is developing. Leaker Digital Chat Station in a recent Weibo post revealed that MediaTek is also working on the Dimensity 8400, a sub-flagship SoC with impressive performance.
The leak reveals that the Dimensity 8400 scores between 1.7 million and 1.8 million on the AnTuTu benchmark. This score puts it on par with, or even ahead of, the recently announced Qualcomm Snapdragon 8s Gen 3, which manages around 1.7 million points in the same test.
But raw power isn’t the only story. The tipster mentions that the most affordable smartphone with the Dimensity 8400 could cost as low as 1,500 yuan (roughly $200). If true, the devices with this SoC will not only offer better performance than their Qualcomm counterparts but will also be cheaper.
Additionally, Chinese tech outlet IT Home reports that in April, Digital Chat Station revealed that Redmi is working on smartphones with various processors, including the Dimensity 9300+, Dimensity 8400, Snapdragon 8 Gen 3, and the upcoming Snapdragon 8 Gen 4.
Interestingly, three of these Redmi models are rumored to share design features, such as a metal frame, glass body, 1.5K or 2K displays, 100W fast charging, and large batteries.
While it’s not confirmed which Redmi phone will use the Dimensity 8400, it might be part of the upcoming K80 series, though this is just speculation on our part.
Keep in mind that these details are still based on rumors, so the official benchmark scores and pricing for the Dimensity 8400 phone could differ from what’s mentioned above. But if the leaks are accurate, the Dimensity 8400 might offer flagship-level performance at a mid-range price, making the smartphone market even more competitive.
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