Qualcomm is expected to unveil the Snapdragon 8 Gen 4, its next-generation flagship chipset for smartphones, in October of this year. Months before the official announcement, a leaked datasheet emerged to reveal its key details.
Snapdragon 8 Gen 4 variants and specifications (rumored)
As per the leaked datasheet, the upcoming Snapdragon 8 Gen 4 chipset has two part numbers, namely SM8750 and SM8750P. The former is a regular version of the chipset, whereas the latter is an overclocked version.
The datasheet further reveals that Qualcomm will build the Snapdragon 8 Gen 4 chipset on an advanced 3nm process, promising significant enhancements in both performance and energy efficiency. It will feature Qualcomm’s latest Oryon CPU, engineered to deliver high-performance computing, and the Adreno 8-series GPU, which is designed to provide top-tier graphics capabilities ideal for gaming and other demanding tasks. The chipset supports dual-channel package-on-package (PoP) high-speed LPDDR5X SDRAM, further boosting its performance capabilities.
In terms of multimedia, the Snapdragon 8 Gen 4 will be equipped with the Qualcomm Spectra ISP 8-series, which is expected to significantly elevate the quality of photography and videography on mobile devices. Additionally, it includes Adreno VPU and DPU units that will handle UHD video encoding and decoding, along with high-definition display support.
The Snapdragon 8 Gen 4 will also excel in connectivity. It integrates a 3G/4G/5G modem capable of supporting mmWave and sub-6 bands. Additionally, it incorporates Qualcomm’s FastConnect 7900 system, enabling the latest wireless technologies like Wi-Fi 7, Bluetooth 5.4, and ultra-wideband (UWB).
Beyond raw power and connectivity, the Snapdragon 8 Gen 4 will incorporate advanced AI and security features. It will feature a Low-Power AI (LPAI) subsystem with a dedicated DSP and AI accelerator, enabling continuous on-device AI processing without compromising battery life.
Audio enthusiasts will also appreciate the Qualcomm Aqstic WCD3955 audio codec, which supports audiophile-grade sound quality. Lastly, the inclusion of a Secure Processing Unit indicates that Qualcomm is prioritizing enhanced security features, making this chipset not only powerful but also secure for a wide range of advanced use cases.
The SM8750 variant is expected to power most flagship phones that are expected to launch in the October–December period in China. The SM8750 variant will power the Galaxy S25 Ultra, which is expected to launch in January 2025. It’s possible that the SM8750P variant will power other flagship phones that release in China around mid-2025.
(source)
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