Samsung is reportedly preparing to expand its foldable lineup in 2024 with the introduction of the Galaxy Z Flip FE, a budget-friendly version of its popular clamshell foldable. In addition, fresh leaks hint at the chipset configurations for both the Galaxy Z Flip FE and its flagship counterpart, the Z Flip7.
Galaxy Z Flip7 is expected to debut the Exynos 2500 chipset
According to X tipster Jukanlosreve, the Galaxy Z Flip7 is expected to feature Samsung’s upcoming Exynos 2500, marking a significant shift from the Snapdragon chips used in previous foldable models like the Z Flip6.
For those unfamiliar, Samsung is facing some manufacturing issues with its 3nm chips. The adoption of the 3nm Exynos 2500 in the upcoming Z Flip 7 instead of the S25 series scheduled to launch in January (which was supposed to equip the chips) suggests that Samsung hopes for an improvement in its yield rate before it needs to mass produce the chips to cut down the manufacturing costs.
Samsung has powered its foldable phones with Qualcomm chips so far and it will be interesting to see how much of an improvement in performance and power efficiency Samsung manages to offer with the Exynos 2500-powered Z Fold 7. Notably, the tipster didn’t mention the Z Fold 7, so that’s still expected to power the Snapdragon 8 Elite chip.
Budget-friendly Galaxy Z Flip FE to use S24FE’s Exynos 2400e
The Galaxy Z Flip FE is expected to launch as an affordable alternative to the premium Z Flip series. The device could feature the Exynos 2400e, a slightly downclocked version of the Exynos 2400 chipset used in the Galaxy S24 FE.
The use of the Exynos 2400e ensures a balance between performance and cost-effectiveness. This chipset has already demonstrated its capabilities in handling everyday tasks effectively, making it a promising option for a budget foldable device.
(Source)
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