Honor is preparing to launch several new smartphones in the Chinese market, including the Honor 400 series, Honor GT Pro, and new foldable devices such as the Magic V4 and Magic V2 Flip. Recently, tipster Digital Chat Station shared details about the Magic V4 in a Weibo post. Now, he has returned with another leak, revealing new information not only about the Magic V4 but also, for the first time, about the Magic V2 Flip.
Honor Magic V2 Flip
According to DCS, the Honor Magic V2 Flip will feature a customized LTPO panel and be powered by the Snapdragon 8 Gen 3 chipset. However, the leak does not disclose other specifications of the device. For reference, last year’s Honor Magic V Flip came with a 6.8-inch foldable LTPO OLED display and was equipped with the Snapdragon 8+ Gen 1 chipset.
Honor Magic V4
The leak further reveals that the Honor Magic V4 will feature a customized LTPO internal foldable display measuring approximately 8 inches. For security, it will be equipped with a side-mounted fingerprint sensor.
Under the hood, the device will be powered by the Snapdragon 8 Elite chipset. In China, it will compete with the Oppo Find N5, which is expected to feature a 7-core version of the Snapdragon 8 Elite. However, unlike the Find N5, the Magic V4 will likely ship with the standard 8-core version of the chip.
In terms of cameras, the Magic V4 will sport a 50-megapixel flagship-level primary sensor along with a telephoto camera. While it is expected to retain a periscope telephoto lens like its predecessor, the leak suggests that it will not be a flagship-grade.
One of the key areas of improvement for this generation is thickness reduction. The Magic V4 is expected to be thinner than the Magic V3, which had a 9.2mm thickness when folded.
Additionally, the leak hints that Honor is moving swiftly with its launch schedule, with both foldable devices expected to debut around June.
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