Samsung is preparing to launch the Galaxy S25 FE, expected in late 2025. While the company initially planned to equip the device with its in-house Exynos 2400e chipset, a new report from Notebookcheck suggests that production issues may lead to the adoption of MediaTek’s Dimensity 9400 as an alternative.
The Dimensity 9400, manufactured by TSMC, outperforms the Exynos 2400e. However, using it could increase costs for Samsung, making the Exynos chip a more cost-effective option. Choosing Exynos also keeps revenue within the company, which is another reason for Samsung’s preference. That said, the superior performance of the Dimensity 9400 might influence the appeal of the upcoming Galaxy S25 FE, especially since the current model (Galaxy S24 FE) uses the Exynos 2400e.
The Dimensity 9400, launched in October 2024, is MediaTek’s flagship-grade SoC with a second-generation All Big Core setup. It has one Arm Cortex-X925 core running at over 3.62GHz, three Cortex-X4 cores, and four Cortex-A720 cores. Compared to the Dimensity 9300, it delivers 35% faster single-core and 28% faster multi-core performance. Built on TSMC’s second-generation 3nm process, it is up to 40% more power-efficient and helps improve battery life.
This isn’t the first time Samsung has utilized MediaTek’s chip on its higher-tier products. The Galaxy Tab S10+ and the Tab S10 Ultra both launched last September, featuring the Dimensity 9300+ processor.
Firmware development for the Galaxy S25 FE has begun, with the US variant identified as model number SM-S731U. The device is expected to run One UI 8 based on Android 16. Historically, Samsung’s FE models have launched in the fall, suggesting a release window between September and November 2025.
As the launch date approaches, more details about the Galaxy S25 FE’s specifications and features are expected to emerge, providing a clearer picture of Samsung’s strategy for this upcoming device.
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