The RedMagic 11 Pro only just went global, but we’re already getting a good look at what’s going on under the hood. A new teardown has surfaced that gives a surprisingly detailed peek at one of the phone’s headline features.
Zack from JerryRigEverything managed to get his hands on a unit and, as usual, put it through his durability routine. The standout feature of this phone is its liquid cooling loop, which the brand has been promoting as a world first in a mass-produced smartphone.
If you couldn’t catch the video, here’s how the liquid cooling works: the loop is made of flexible material, and a piezoelectric micropump sits on top of it and vibrates. Inside the loop, there is a one-way check valve that allows the liquid to flow only in one direction. This loop touches a metal part near the main processor and carries the heat away from it, then dissipates it through a larger area on the back panel.
But this is not even the only active cooling solution RedMagic packed into this phone: there is a fan that reaches 24,000 RPM. The air passes through an isolated duct, maintaining IPX8 water resistance. And of course, the brand didn’t forget to add conventional cooling measures: this phone reportedly includes the industry’s largest VC heatsink. All to make the most of the Snapdragon 8 Elite Gen 5.
As for the durability, the results were pretty predictable. The display started scratching at level 6 on the Mohs scale, with deeper marks at level 7 — basically standard for modern smartphone glass. But the bend test result was impressive. The phone didn’t flinch. No bends, no cracks, nothing, no matter which direction it was pushed from. Considering there’s a full liquid cooling setup inside, that’s actually pretty impressive.
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