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Samsung may be preparing a noticeably larger 200MP camera sensor for future flagships. According to new leaks out of China, the company is working on what’s reportedly called the ISOCELL HPA.

The information comes from Digital Chat Station, who claims the ISOCELL HPA will feature a 1/1.12-inch optical format. That would make it significantly larger than Samsung’s recent 200MP sensors, such as the HP2 and HP3, which sit at around 1/1.3-inch.

In practical terms, a jump to 1/1.12-inch brings the sensor much closer to the 1-inch class used by some competitors. A larger surface area generally means better light gathering, which can improve low-light performance, detail retention, and overall image quality.

Another key detail in the leak is the use of LOFIC (Lateral Overflow Integration Capacitor) technology. LOFIC is designed to extend dynamic range at the hardware level, helping preserve highlight and shadow detail in high-contrast scenes. Instead of relying entirely on multi-frame HDR processing, the sensor itself handles more of the dynamic range capture. If implemented well, that could lead to more natural-looking images and fewer blown highlights.

The ISOCELL HPA is reportedly targeted for a 2027 release. As with many recent high resolution ISOCELL sensors, it may first appear in devices from Chinese smartphone brands before making its way into Galaxy flagships.

For Samsung’s own lineup, another leak from Ice Universe suggests the Galaxy S27 Ultra could instead use a different 200MP sensor called the ISOCELL HP6. That unit is said to retain the 1/1.3-inch size seen in recent generations but incorporate LOFIC improvements and refined image processing to close the performance gap.

In other words, Samsung may be pursuing two parallel strategies: increasing sensor size for its Chinese customers while continuing to optimize its existing form factor for Galaxy flagships.

With a 2027 timeline, there’s still time before any of this becomes official. Still, the direction is clear: Samsung finally appears to be investing in sensor physics and underlying imaging hardware.

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