In September, Xiaomi is expected to become the first brand to launch flagship phones powered by the Snapdragon 8 Elite Gen 6 chipset. The lineup is likely to include the Xiaomi 18, Xiaomi 18 Pro, and Xiaomi 18 Pro Max. Reports have claimed that, unlike previous generations, the global variants will not take long to arrive.
Traditionally, Xiaomi unveils its flagship phones in China in September, followed by a global launch in the first quarter of the following year. This appears to be changing, as some global Xiaomi 18 models have now received their first certification. At the same time, a new leak has revealed details about the Xiaomi Pad 8s Pro, which is also expected to launch soon in China.
Global Xiaomi 18 series EEC certified
As seen above, two Xiaomi smartphones with model numbers 2609BPN61G and 2611FPNFAG have appeared in the database of Europe’s EEC certification platform. These devices were previously spotted in the IMEI database, where they were believed to belong to the Xiaomi 18 series. However, their official marketing names have yet to be confirmed through the IMEI listings.
The 2611FPNFAG is believed to be the standard Xiaomi 18, while the 2609BPN61G could be the Xiaomi 18 Pro Max. It is also speculated that the Xiaomi 18 Pro may not receive a global release.
While the Xiaomi 17 Ultra was unveiled in December last year, recent reports suggest that the Xiaomi 18 Ultra may have been cancelled. Instead, August could see the debut of the Xiaomi 18 Fold, which is expected to feature a wide foldable design similar to the Galaxy Z Fold 8. However, the foldable is also expected to remain exclusive to the Chinese market.
Xiaomi Pad 8s Pro incoming
According to tipster Bald Panda, the upcoming Xiaomi Pad 8s Pro will feature a 12.5-inch LCD panel with a 3.2K resolution, the Xring O3 chipset, a 12,000mAh battery with 120W charging, a 32-megapixel front-facing camera, and a dual rear camera system comprising a 50-megapixel primary sensor and a 2-megapixel secondary camera.
The Xiaomi 18 Fold is also expected to feature the Xring O3 chip. Therefore, it is likely that both devices may debut together in China next month.
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