Quite a number of people are of the opinion that the next Meizu flagship will have a Samsung Exynos processor since their falling out with Qualcomm hasn’t yet been resolved. It appears that won’t be the case as a Weibo post from an industry analyst says otherwise.

The post which was made by @MochaSocialistWorker mentions that Meizu’s next flagship will use a Helio X30 processor. The Helio X30 chip was announced in September, and the deca-core chipset clocked at 2.8GHz is currently the most powerful SoC from the chip manufacturer and the first to be built on a 10nm TSMC process.

Mediatek has worked hard on this chip and ironed out most of the issues that have plagued their previous processors such as the GPU. The new chip will also support up to 8GB of RAM and UFS 2.1 storage.

According to @MochaSocialistWorker, the decision to not use Samsung’s processor is as a result of product schedule delays. The company has also been asked to pay a fine to Qualcomm which will set it back a bit before their working relationship can continue.

READ MORE: Meizu’s Bezel-less Phone Might be The Meizu Pro 7

They have also taken into consideration the supply issues that plagued the Snapdragon 820 this year and will rather settle with Mediatek who don’t seem to have issues with meeting up with orders.

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Chip-maker MediaTek has confirmed some of the specifications of its expected high-power Helio X30 chipset  which has been making the headlines of late. In an interview with Sun Chanhxu, MediaTek COO Zhu Shangzu threw more light on the Helio X30.

Zhu Shangzu expressed his optimism that this year’s X-series and P-series will significantly improve the consumer perception of the MTK brand, hence the quest to manufacture high-end flagship capable chipsets that could see them being featured in flagship phones.

Also, on the specifications, Zhu Shangzu confirmed that the Helio X30 will be manufactured by TSMC using 10nm manufacturing process. The processor will also provide support for 3 baseband carrier aggregation, Cat. 10 – Cat. 12 network baseband. Also, MediaTek shelved the ARM Mali GPU on this one and instead opted for a PowerVR GPU which the MediaTek says provides better performance and more efficient power consumption.

In summary, the Helio X30 would rank as the latest among MediaTek’s second generation of deca-core processors which consist of a dual-core 2.8GHz A73 next-gen architecture code-named Artemis, 4 x A53(2.2GHz) cores and 4 x A35 (2GHz) cores.

Related: Mediatek Helio X30: New Leak Reveals Powerful Deca-Core Setup With PowerVR GPU

In the aspect of memory, the Helio X30  will support four channels LPDDR4 RAM, up to 8GB RAM storage modules, and support for UFS 2.1 technical standards.

We won’t be seeing the Helio X30-powered smartphones very soon as MediaTek has scheduled November for mass production of the Helio P20, its latest addition in the lower P-Series and also MediaTek’s first chip using 16nm process announced in February. Thus considering the available time frame, the  Helio X30 isn’t expected to feature in smartphones until sometime around the middle of next year.

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