This week, MediaTek expanded its mid-range chipset lineup with the inclusion of Dimensity 8350. It’s a high-performance smartphone chip that powers the upcoming Oppo Reno 13 series and many mid-range phones in the future.

The Dimensity 8350 specs are largely similar to the Dimensity 8300, which raises an important question: Does the new chip offer any improvements, or is it just a new name with minor tweaks? Let’s compare the two chips and see how they stack up against each other.

Dimensity 8350 vs Dimensity 8300: breaking down the differences

The new Dimensity 8350 has a Cortex-A715 core with a maximum clock speed of 3.35GHz, and so does the Dimensity 8300. In fact, the remaining seven cores are also unchanged: three Cortex-A715 cores at 3.2GHz speed and four Cortex-A510 cores at 2.2GHz. Both chips have been cooked into TSMC’s facility using their 4nm process.

So, the bottom line is that the two chips have no CPU differences. Even the GPUs are the same, but there is a slight improvement in the gaming technology. The Dimensity 8350 and 8300 rock the Mali-G615 MC6 GPU, which has performance comparable to the Adreno 642 in Qualcomm chips. It can handle popular titles such as Genshin Impact and PUBG Mobile.

Despite having the same GPUs, the newer Dimensity 8350 offers better gaming performance, thanks to the new StarSpeed Engine. Its older chip has HyperEngine for gaming. MediaTek says the new gaming engine reduces power consumption by up to 10%. At high frame and full frame, the power consumption is reduced by up to 24%. The speed of scene transition is up to 24% better, and the touch response speed is 5% improved.

Camera capabilities are also unchanged. Both have the same 14-bit MediaTek’s Imagiq 980 HDR ISPs, which support up to 320MP camera resolution and 4K video recording. Among the camera features are video HDR, video bokeh, video EIS, video NR, and AI color for capture.

Both chips have the same AI engine, MediaTek NPU 780. It supports advanced generative AI tasks and is capable of running large language models (LLMs) with up to 10 billion parameters. The similarities also include memory and storage features, as the Dimensity 8350 and 8300 support LPDDR5X RAM and UFS 4.0 + MCQ storage.

They also have the same connectivity features: Wi-Fi 6E, Bluetooth 5.4, and location services (GPS, Beidou, GLONASS, Galileo, NavIC, QZSS). The peak download speed is capped at 5.17 Gbps.

Dimensity 8350 vs Dimensity 8300: Which is better?

The Dimensity 8350 and Dimensity 8300 are high-performance midrange chips. However, they are essentially the same, except for an improved gaming engine on the newer chip. Ultimately, it comes down to price — go for the more affordable option.

MediaTek Dimensity 8350 phones:

• Oppo Reno 13
• Oppo Reno 13 Pro
• Oppo Pad 3

MediaTek Dimensity 8300 phones:

• Poco X6 Pro (review)
• Redmi K70E

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MediaTek‘s been busy lately, launching their new flagship Dimensity 9300 SoC earlier this month. And now they’re back with another announcement, the Dimensity 8300. This new chip is designed for mid-range smartphones, but it packs a serious punch, offering significant improvements in performance, efficiency, and AI capabilities.

MediaTek Dimensity 8300 Overview

Built on a second-generation TSMC 4nm process, the Dimensity 8300 delivers significant performance and efficiency improvements over its predecessor. 

The chip is built on a 4nm process and has a triple-tier CPU architecture with one Cortex-A715 core clocked at 3.35GHz, three Cortex-A715 cores clocked at 3GHz, and four Cortex-A510 cores clocked at 2.2GHz. This configuration promises a 20% performance boost and up to 30% better efficiency compared to the Dimensity 8200.

The graphics capabilities have also received a major upgrade, with the Mali-G615 MC6 GPU offering a claimed 60% performance boost and a 55% efficiency gain. That means you can expect smooth and responsive gaming experiences on devices powered by this chipset.

The Dimensity 8300 also brings several improvements to the camera department, including support for 4K/60fps HDR video, more power-efficient video recording, and AI-Color functionality for enhanced image quality.

An interesting feature of the Dimensity 8300 is the APU 780 AI silicon, which supports large language models (LLMs) with up to 10 billion parameters. This enables features like real-time language translation, text summarization, and even creative writing.

Other notable features of the Dimensity 8300 include AV1 decoding, Bluetooth 5.4, Wi-Fi 6E, and support for refresh rates of up to 120Hz at WQHD+ resolutions (or 180Hz at FHD+).

The first smartphone powered by the Dimensity 8300 will be the Redmi K70e, which is likely to launch later this month.

Related:

• MediaTek Dimensity 9300 benchmark results are here, and they’re very impressive
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• CapCut Creative Suite Guide: Pros and Cons Explored
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(Via)

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After Dimensity 9300, MediaTek is gearing up to unveil its latest smartphone chipset, the Dimensity 8300, on November 21. Details about the chipset have been trickling out in recent weeks, and now renowned tipster Digital Chat Station has provided a comprehensive overview of the key specifications.

MediaTek Dimensity 8300 Specs (Rumored)

According to the tipster, the Dimensity 8300 is built on TSMC’s 4nm manufacturing process. And, the core CPU configuration comprises a single high-performance Cortex-A715 core clocked at 3.35GHz, three additional Cortex-A715 performance cores running at 3.32GHz, and four power-efficient Cortex-A510 cores operating at 2.2GHz. The graphics are handled by a Mali-G615 MC6 GPU.

The 4+4 core architecture is similar to that of the Dimensity 8200 chipset. Here, the four Cortex-A715 cores will handle most of the performance-intensive tasks and four Cortex-A510 cores will focus on efficiency-related things.

The Dimensity 8300 has also been spotted in a Geekbench 6 listing on a Redmi phone, believed to be part of the upcoming K70 series. 

The phone, identified with the model number Xiaomi 2311DRK48C, achieved a single-core score of 1512 and a multi-core score of 4886. This performance puts it slightly ahead of the Dimensity 8200 and 8200-Ultra chipsets.

According to leaker Digital Chat Station, the Dimensity 8300’s performance is expected to surpass that of the Qualcomm Snapdragon 7+ Gen 2 SoC.

Further details regarding the Dimensity 8300’s capabilities and performance will be available upon its official launch on November 21st.

Related:

• MediaTek Dimensity 9300 benchmark results are here, and they’re very impressive
• Snapdragon 7 Gen 3 expected to launch in next two weeks
• Realme GT Neo 6 with Snapdragon 8 Gen 2 could be in works, price range tipped
• IDC Q3 2023 report: Realme, Poco, OnePlus, and Infinix shine in Indian smartphone market

(Via)

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