Just weeks after wrapping up its current lineup with the Pixel 10a, Google may already be testing its new phones. A new Geekbench listing has surfaced, and while nothing is confirmed, it hints at early hardware that could belong to the Pixel 11 series, and more importantly, the next-generation Tensor G6 chip.

The listing is tied to a device called “Google Kodiak.” That name isn’t new. It was previously associated with the Pixel 10 Pro XL. But according to Notebookcheck, this new appearance could point to a Pixel 11 model instead. The reason comes down to the processor configuration.

This could be the Tensor G6 setup

The device in question runs a 7-core Tensor SoC, which is unusual. The Pixel 10 Pro XL uses an octa-core chip. That alone suggests this isn’t simply a re-test of existing hardware. 

The new configuration includes one Arm C1-Ultra core clocked at 4.11GHz, four Arm C1-Pro cores at 3.38GHz, and two additional C1-Pro cores at 2.65GHz. The clock speeds are also higher than what we’ve seen on the Tensor G5.

For comparison, the Pixel 10 Pro XL is powered by an octa-core setup with one Cortex-X4 core at 3.78GHz, five Cortex-A725 cores at 3.05GHz, and two Cortex-A520 cores at 2.25GHz. 

Graphics also differ. The new listing shows a PowerVR C-Series CXTP-48-1536 GPU, while the Pixel 10 Pro XL uses a PowerVR DXT-48-1536.

However, the benchmark scores are nothing to write home about. The phone posted a single-core score of 845 and a multi-core score of 2657. These numbers are extremely low for a modern flagship. It’s possible the chip is missing software optimizations, or that this is very early hardware not meant for performance testing.

Still, it’s worth being cautious. There’s no guarantee this listing is genuine. Benchmark databases are often filled with prototypes, mislabeled devices, and sometimes even fake entries. The Pixel 11 series isn’t expected until summer 2026, and the Tensor G6 hasn’t been announced.

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Google could be planning a major change to its in-house silicon strategy. According to new leaks, the company’s upcoming Pixel 11 series may finally move away from Samsung’s modem tech — a decision that could address two of the biggest complaints about the Pixel lineup: battery life and connectivity.

The leak, shared by tipster Mystic Leaks on Telegram, claims that Google’s next chip, the Tensor G6, will no longer rely on Samsung hardware. Instead, the company is reportedly testing MediaTek’s M90 modem, which was announced earlier this year. For those unfamiliar, the Tensor G5 still uses Samsung’s Exynos 5400 modem to handle cellular connectivity. MediaTek’s alternative promises peak download speeds of up to 12Gbps, along with improved power efficiency and built-in support for dual 5G SIMs and satellite connectivity.

If true, this marks the first time Google has used MediaTek components in its flagship phones. It would also represent a clean break from Samsung’s Exynos modems, which have been blamed for excessive heat and faster battery drain during 5G use. Even with the switch to TSMC’s 3nm process in the current Tensor G5, Google’s chips have yet to match Qualcomm’s Snapdragon series in performance. For reference, here’s a benchmark comparison between the Tensor G5 and Tensor G4.

By partnering with MediaTek, Google seems to be taking a more practical approach — improving efficiency without rebuilding the Tensor architecture from scratch. The Pixel 11, expected to debut in late 2026, could see better endurance and connectivity thanks to MediaTek’s new modem. Google increased the battery capacity from 4,700 mAh on the Pixel 9 to 4,970 mAh on the Pixel 10, and a similar boost with the Pixel 11 could extend the runtime even further.

Still, some users remain cautious. The Tensor G5’s TSMC move brought modest gains but not the leap many had hoped for. Whether or how much MediaTek’s M90 can change that story remains to be seen.

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The Pixel 11 might be Google’s biggest leap in smartphone performance yet. A new report suggests that the upcoming Tensor G6 chip—set to power the Pixel 11 series in 2026—could be built on TSMC’s cutting-edge 2nm process. If true, this would mark a major shift in Google’s silicon strategy, potentially giving it a performance edge over rivals like Apple and Qualcomm.

Google is already expected to move away from Samsung Foundry in favor of TSMC for the upcoming Tensor G5, which will reportedly use TSMC’s 3nm process in the Pixel 10 series later this year. But according to a new report from Taiwan’s Commercial Times, Google may be planning an even more aggressive move for 2026. The Tensor G6—codenamed “Malibu”—is now rumored to adopt TSMC’s next-gen 2nm node (N2), rather than the previously rumored 3nm N3P node.

If accurate, this shift could deliver major efficiency and performance benefits. Compared to the Tensor G5, the G6 could offer up to 15% faster performance and 30% better power efficiency. That would be an even bigger step up from the 4nm Tensor G4 chip currently powering the Pixel 9 Pro.

The Tensor G6 is rumored to feature a next-gen CPU layout: a single ARM Cortex-X930 prime core, six Cortex-A730 performance cores, and one Cortex-A530 efficiency core. It’s also expected to include a 3-core Imagination CXTP GPU running at 1.1GHz. Paired with LPDDR5X RAM and UFS 4.0 storage, the chip could deliver serious improvements in both AI and gaming performance.

Google’s deeper partnership with TSMC could also extend into future Pixel generations, possibly up to the Pixel 14. And with Qualcomm’s Snapdragon 8 Elite 2 still expected to use a 3nm node in 2025, Google’s rumored 2nm jump could give the Pixel 11 a much-needed advantage in the Android flagship race.

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Google has used its custom-designed Tensor chips to power Pixel phones since the Pixel 6. But so far, these chips haven’t matched the performance or efficiency of their competitors. 

This may change soon, as leaked internal documents obtained by Android Authority reveal Google’s plans to improve with its upcoming Tensor G6 chip, codenamed “Malibu.”

The changes for the Tensor G6 are expected to focus on thermals and efficiency gains. Major performance improvements are not in the cards, and even the Tensor G5 is only expected to offer a modest performance boost over the current chip.

So it looks like Google’s SoC strategy isn’t prioritizing performance gains for now. In fact, Android Authority reports that the Tensor G6 chip may even see some “downgrades” in certain areas. 

Tensor G6 with improved efficiency?

For instance, Google is reportedly forgoing a new GPU for the Tensor G6 and opting for an older design initially intended for the Tensor G4.  If so, the Tensor G6 might lack ray tracing support, which the Tensor G5 is expected to have. So it’s a step backward in that regard.

The decision to use the G4’s GPU in the G6 is reportedly driven by Google’s goal to reduce the chip’s die area. The Pixel 10’s chip is said to be quite large at 121 mm² when built using TSMC’s 3nm process node, while Apple’s A18 Pro, which uses the same process, measures just 105 mm².

Google’s target for the Tensor G6 is a 105 mm² die size, factoring in a 4% area saving from TSMC’s newer N3P process node (the G5 uses N3E). 

To achieve this, using the G4’s GPU is said to reduce the die area by approximately 12%. Google is also reportedly cutting space by reducing the DSP (digital signal processor) by one core and halving the SLC (system-level cache) to 4MB. However, the report suggests there won’t be changes to the CPU size.

All in all, Google is trying to make smaller, more efficient chips, focusing on space-saving rather than performance improvements.

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