The Pixel 11 might be Google’s biggest leap in smartphone performance yet. A new report suggests that the upcoming Tensor G6 chip—set to power the Pixel 11 series in 2026—could be built on TSMC’s cutting-edge 2nm process. If true, this would mark a major shift in Google’s silicon strategy, potentially giving it a performance edge over rivals like Apple and Qualcomm.
Google is already expected to move away from Samsung Foundry in favor of TSMC for the upcoming Tensor G5, which will reportedly use TSMC’s 3nm process in the Pixel 10 series later this year. But according to a new report from Taiwan’s Commercial Times, Google may be planning an even more aggressive move for 2026. The Tensor G6—codenamed “Malibu”—is now rumored to adopt TSMC’s next-gen 2nm node (N2), rather than the previously rumored 3nm N3P node.
If accurate, this shift could deliver major efficiency and performance benefits. Compared to the Tensor G5, the G6 could offer up to 15% faster performance and 30% better power efficiency. That would be an even bigger step up from the 4nm Tensor G4 chip currently powering the Pixel 9 Pro.
The Tensor G6 is rumored to feature a next-gen CPU layout: a single ARM Cortex-X930 prime core, six Cortex-A730 performance cores, and one Cortex-A530 efficiency core. It’s also expected to include a 3-core Imagination CXTP GPU running at 1.1GHz. Paired with LPDDR5X RAM and UFS 4.0 storage, the chip could deliver serious improvements in both AI and gaming performance.
Google’s deeper partnership with TSMC could also extend into future Pixel generations, possibly up to the Pixel 14. And with Qualcomm’s Snapdragon 8 Elite 2 still expected to use a 3nm node in 2025, Google’s rumored 2nm jump could give the Pixel 11 a much-needed advantage in the Android flagship race.
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