Thanks to the numerous leaks, rumors and further coverage of the Redmi Pro and the Xiaomi Notebook, there would hardly be any fans on the internet who are unaware about the July 27 conference from Xiaomi next week. Recently, there has been so much information about these two products that Gizmochina’s majority of the Chinese news coverage have been focused on these two devices.
Just a few minutes back, we reported that Xiaomi Redmi Pro is confirmed to feature Helio X25 deca-core chip and dual cameras. Now, real life images of the Redmi Pro’s metal back have just surfaced online, giving us a better look at the upcoming handset. Like what we saw in the earlier leak, the new images confirm that the phone will come with a brushed metal body. This is definitely a change from the smooth metal finish on previous Redmi models that have been announced by the company.
Since we have seen that there is no fingerprint sensor at the back, it would most likely end up on the front, embedded into the home button. The previous leak had confirmed the presence of dual cameras on the top of the back panel and this one confirms the same design.
RELATED: Redmi Pro Camera Samples Surface: Amazing Bokeh From Dual Cameras
This design looks quite premium thanks to its brushed metal finish and with powerful specs like Helio X25, OLED display, and dual cameras, the Redmi Pro will definitely give other mid-range flagships a run for their money. Considering these specs, the phone will be costlier than existing Redmi handsets. If the rumored 1499 Yuan ($225) price tag turns out to be true, the phone would be one of the best value for money handsets in the market today!
How much are you willing to pay for the Redmi Pro with these specs?
