Teardown of Elephone P6000 Pro 3GB version

by shanos 1

At the beginning of 2015 the original Elephone P6000 was one of the first Chinese smartphones to come with a 64bit SOC, over time it became very popular with buyers, perhaps it was the build quality or more likely the amount of third party ROM support with Roms like CM12.1, VIBE 2.5, ColorOS and Flyme all having made an appearance.

Elephone have upgraded the P6000 with an Octa core World Mode MT6753 SoC and 3GB RAM, the price has remained the same at just $119.99 (£77), have they cut down on quality or components to keep the price the same? Elephone have kindly provided a teardown so lets take a look inside and find out.

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The battery is rated at 2700mAh and takes up more than half of the total space inside the phone (dimensions are 76 x 60 x 5mm) The battery should be able to handle a day of medium to heavy use, possibly more for light users.

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The GPS, wifi and Bluetooth integrated antenna are located top left,  on the right side is one of the two network antennas, the other network antenna is located at the bottom of the phone.

The SIM card slots and TF card slot are located under the camera.

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Dust filters are in place on top of the speaker and another at the bottom of the back cover, its small things like this that help to keep phones in good condition and prevent damage.

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After removing all the screws, we can now see the mother board with all of the integrated chips and cameras.

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The parts are neatly organised and a bar code sticker is glued on to the welded metal cover, Elephone have advised that each chip is individual and has its own unique bar code.

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The secondary board has the USB port, microphone and a haptic feedback motor which is soldered on to the board, the board  is mounted to the chassis with screws.

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Pull up the 0.8mm diameter copper shaft cable measuring 93.4mm from the board.

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Carefully remove the FPC (Flexible printed circuit) connection on the mother board, and tear apart the protective sticker (part of the FPC connects directly to the secondary board).

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The three points at the bottom left are the network antenna connectors. The thickness of the board is 0.6mm.

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To remove the mother board, disconnect the FPC connection from the display, it’s located on the right of the board.

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Then gently prize up the touch panel connector.

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Disconnect the 2MP front camera.

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The button FPC is glued tightly on the frame, so prize that up very carefully, we can now take the mother board out.

p6000pro 18The pictures shows the OmniVision 13MP primary camera and 2MP front camera.

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The system chips are all protected by a metal alloy shield on the mother board.

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The MT6753V SoC on the right and SEC (Samsung) 525 RAM chip on the left.

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P6000 Pro MT6328V power management chip as found in the Meilan Note2.

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The phone contains an additional metal plate for enhanced strength and rigidity.

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The display is an LG 5.0” unit with OGS and IPS technology, which help make the touch panel just 0.79mm thick, with outstanding viewing angles.

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There you have it, based on the quality of the components chosen for the phone, the upgrade to an MT6753 SoC and 3GB RAM, and the apparent build quality the significant upgrade to the MT6753 SoC and 3GB RAM, the P6000 Pro looks like it will be a highly competitive phone in the low end market place.

Please leave comments below

Regards Shanos

Originally posted @ gadgetz.tv

Currently on pre-sale at www.elephone.hk or via Gearbest