After LeEco invested in Coolpad, the collaboration is finally resulting into a new smartphone series. The new phone is confirmed to be called as the Cool1 and expect some pretty high-end hardware inside. Thanks to the earlier leaks, we have a good idea as to what to expect from the new flagship smartphone that will reportedly be released on August 10. Now, we have got some pictures of the Cool1 with dual cameras on board, all thanks to TENAA.
We can clearly see the Cool branding at the back, with the words, “LeEco inside” just below it. Plus, the dual cameras at the back are evident along with the dual tone LED flash. There is a fingerprint sensor at the back as well. This picture also confirms that the phone will come with a metal body, much like most other flagship phones this year.
The front is actually pretty clean, with a display and sensors + camera on top. All the buttons, including the power and volume keys are located on the right side of the phone. Seeing that the SIM tray is located on the left, it’s likely that the back is non-removable.
The specs of the Cool1 smartphone have already been leaked. It is said that the phone will come with a 5.5-inch 2K resolution display and will be powered by the Snapdragon 820 chipset. There will be 4GB of RAM and 64GB of internal storage on board. Inside, you will get a decent 3500mAh battery as well. It is further said that the Cool1 will come with dual OS, which gives users the option of choosing between Android Marshmallow based CoolUI and EUI.
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LeEco’s phones are usually very competitively priced, so we can expect the same to be the case with the new Cool1. Plus, considering that the dual camera equipped Xiaomi Redmi Pro starts at 1499 Yuan ($224), it is possible that the upcoming Cool1 flagship is priced under 1999 Yuan to further intensify the competition in this price segment.
Well, August 10 is the date we expect to meet this new flagship, which is just a week away. So, stay tuned for more details.
