Recent reports have suggested that MediaTek would be introducing Helio P70 and Helio P40 chipsets at the Mobile World Congress (MWC) 2018 event in the coming month. Ulefone, a domestic smartphone brand from China has now confirmed that it will be introducing the Ulefone T2 Pro as the world’s first smartphone powered by MediaTek Helio P70. Below is the official MWC 2018 invitation for the launch of Ulefone T2 Pro.

Ulefone T2 Pro MWC 2018 Launch

The above image shows that the Helio P70 chipset will be seen first on a Ulefone smartphone that sports a notch enabled full screen design like the iPhone X. The company has confirmed the name of the device as Ulefone T2 Pro.

Shown below is the render of the upcoming Ulefone T2 Pro. It reveals that the smartphone would be sporting an impressive full screen design with a notch that is smaller than iPhone X. Because of the notch, the screen of the T2 Pro will be delivering an aspect ratio of 19:9 and screen resolution of 1080 x 2280 pixels like the iPhone X. As of this writing, there is no information available on the other specs of the phone. The handset will be sporting glass panels on front and rear sides with a metallic frame placed in between. The rear panel has a horizontally arranged dual camera setup.

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The Helio P70 from the Taiwanese chip maker is said to be a 12nm chipset manufactured by TSMC. The octa-core chipset has four cores of Cortex A73 running at 2.5 GHz and four cores of Cortex A53 clocking at 2.0 GHz. The chipset also rumored to feature Mali-G72 MP4 800 MHz graphics and carry support for eMMC 5.1, UFS 2.1 dual-channel LPDDR4x 3733 RAM of up to 8 GB and Cat. 12 LTE modem. It is also expected to come with some support for AI capabilities.

The MediaTek Helio P70 powered Ulefone T2 Pro is expected to deliver stellar performance as the chipset was recently spotted with an impressive average benchmarking score of 156,906 on AnTuTu. The performance of the Helio P70 seems to be much better than Snapdragon 660 by Qualcomm. It appears that the Helio P70 has been designed to take on the upcoming Snapdragon 670 chipset.