Snapdragon 670’s Entire Specifications Leaked, May Unveil at MWC 2018

by Anvinraj Valiyathara 0

Qualcomm has already launched the Snapdragon 845 flagship chipset in December last year. It is expected to power smartphones like Samsung Galaxy S9, Galaxy S9+, Xiaomi Mi MIX 2S, Sony Xperia XZ Pro, Xperia XZ2 and Nokia 8 Sirocco. Previous reports have revealed that the upper mid-range Snapdragon 670 SoC will be launched soon as a successor for Snapdragon 660 from last year. Well-known tipster Roland Quandt has revealed key details of the Snapdragon 670.

According to Quandt, the Snapdragon 670 will be a 10nm chipset that will not be based on the classic big.LITTLE architecture. Instead of four low-end and four high-end CPU cores, the Snapdragon 670 will be featuring a combination of low-end hexa-core processor and dual-core high-end processor.

The low-end cores called Kryo 300 Silver will deliver a maximum clocking speed of 2.6 GHz. The Kryo 300 Silver is nothing but an adapted edition of ARM Cortex A55. The high-performance cores are dubbed as Kryo 300 Gold, a custom version of ARM Cortex A75. The Kryo Gold will be able to churn out a max processing of 1.7 GHz. This shows that the smartphones driven by this new chipset will be able to deliver stellar performance.

Each of the cores has 32KB L1 cache and each cluster gets 128KB L2 cache. For the entire chipset, there is 1MB of L3 cache. The SoC also includes Adreno 615 that works at 430 MHz or 650 MHz and it can even reach 700 MHz dynamically.

Qualcomm Snapdragon

Read More: Snapdragon 845 Looks A Lot Faster Than Snapdragon 835 In New Benchmarks

The Snapdragon 670 will support up to WQHD display resolution, but the exact information on it is yet to surface. The Snapdragon X2X modem will be able to produce maximum download speeds of 1 Gbps. When it comes to memory, the SD670 offers support UFS 2.1 and eMMC 5.1.

The specialized image processor packed inside the Snapdragon 670 allows its Adreno 615 graphics to support dual camera configuration. As of this writing, there is no information available on the maximum camera resolution supported by this chipset. However, it has been found that the reference design hardware includes 13-megapixel + 23-megapixel dual camera setup.

As of this writing, there is no information available on the launch date of the new chipset. However, it is likely that the company may unveil it at the Mobile World Congress (MWC) 2018 event later this month in Barcelona, Spain. It is also speculated that the Snapdragon 670 powered smartphones would be arriving in the market soon.

(source)

 

 

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