Qualcomm Snapdragon 8150 scores 362,292 on AnTuTu, highest yet for an Android device

by Jeet 0

Qualcomm is reportedly working on its new flagship chipset which is expected to be unveiled by the end of this year. The upcoming flagship chipset is the successor of the Snapdragon 845, is rumored to be called Snapdragon 8150 and not Snapdragon 855.

Now, ahead of the official announcement of the Snapdragon 8150, the chipset’s benchmark score has surfaced online through AnTuTu. The chipset has scored 362,292 points on AnTuTu, making it the first chipset running on Android platform to have crossed the benchmark of 360,000 points.

Qualcomm Snapdragon 8150 AnTuTu Score

In comparison, the Huawei Mate 20 series devices running on Kirin 980 chipset managed to score an average of 311,840 points while the highest score so far for the Qualcomm Snapdragon 845-powered device is currently held by Xiaomi’s Black Shark Helo smartphone which scored 301,757 points.

Based on the results, it appears that the Snapdragon 8150 is providing 16 percent better performance compared to the Huawei‘s Kirin 980 and 20 percent better performance than its predecessor, the Snapdragon 845. The score of the Snapdragon 8150 could also increase after a bit of optimization by the manufacturers.

Recently, a Geekbech listing revealed that the chipset logged a score of 3,281 in the single-core test, and 11,023 in the multi-core test. These scores are higher than Snapdragon 845 that logged a score of 2,500 in single-core test and 8,900 in multi-core test.

The Qualcomm Snapdragon 8150 is expected to come with three-cluster CPU core design, similar to Kirin 980 and Exynos 9820. It will feature one large performance core running at a clock speed of 2.84GHz, three medium cores clocked at 2.4GHz, and four small efficiency cores clocked at 1.78GHz. It will pack Andreno 640 GPU that is claimed to offer 20 percent better performance compared to Adreno 630.

 

Read More: Qualcomm SM6150 and SM7150 mid-range processors are reportedly in development, details surface

 

The chipset is expected to be manufactured using the newest 7nm process by TSMC and the die size is going to be 12.4 x 12.4mm. While the chipset is expected to be announced next month, the devices running on Snapdragon 8150 are expected to be available from the first half of 2019. Meizu is expected to be among the first to launch device powered by SD8150 SoC.

SD8150 antutu scores

(Source)