Taiwanese chip manufacturer TSMC has announced that it has commenced mass production of its second-generation 7nm+ process. The 7nm+ process takes over from the 7nm technology used on present-day flagship chipsets like the Kirin 980, Apple A12 etc. The company is utilizing EUV lithography for the first time in the production, edging closer to Intel and Samsung.
The 7nm+ chipset will be used on next-gen Apple A13 chipset as well as on Huawei’s next-gen Kirin 985 SoC. The A13 chipset for Apple will power the 2019 iPhones. Meanwhile, reports from China indicate that TSMC will continue supplying Huawei parts for the upcoming Kirin 985 that would be used on the Mate 30 which is expected to be launched later this year. This is coming on the heels of mounting pressure from the US government on allies to boycott Huawei’s technology.
In addition, the company has also reportedly started trial production of 5 nm process wafers using EUV technology. Mass production is expected to commence in Q1 2020, such that by mid-next year, we should start seeing TSMC 5nm chipsets in the market by June 2020.
(source)
