Redmi, the year-old subbrand of Xiaomi will be announcing its next flagship smartphone Redmi K30 Pro on March 24 in China. Ever since the brand unveiled the launch date, it has been teasing the specs of the handset for a few days now. Continuing the trend, the brand’s General Manager Lu Weibing today unfolded that the upcoming Redmi K30 Pro will cram in up to 61 components per square centimeter in its chassis.
A couple of days back, Mr. Lu explained the difficulties involved in implementing pop-up camera design in 5G smartphones. He said that 5G components require more space and thus manufacturers have been avoiding pop-up cameras lately in 5G devices with Redmi K30 Pro being an exception. He also added that 5G phones require a bigger battery and better thermal performance, which unfortunately cannot be achieved by dividing the motherboard into two parts – a common design in phones with pop-up cameras.
Thus, Redmi K30 Pro opted for a different approach that compelled the brand to adopt the now-common sandwich (stacked) motherboard design present in flagship smartphones like its parent company’s Mi 10 Pro. As per Mr. Lu, the device will cram in up to 61 components per square centimeter by stacking up one motherboard over another. He also said that the phone will include 3885 components, which is 268% more than that of last year’s Redmi K20 Pro.
He also confirmed that the pop-up camera will pop in / out within 0.58 seconds, thanks to the new stepper motor with a speed of 14.2mm per second, up from 11.5mm per second of its predecessor. That means, it will be 27% faster than the last generation and thus will retract quicker than before during accidental falls.
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