Samsung, which has its own chip manufacturing arm, has so far been focused on processors for smartphones. However, the company is now looking to reduce dependency on third-party vendors and is also expanding its chip business to other categories.
In line with that, the South Korean giant has announced three new automotive chips — Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems, and the ASIL-B certified S2VPS01 power management IC (PMIC) for the Auto V series.
In a statement, Samsung says that demand is rising for “high-tech” automotive chips that can handle more entertainment consumption and increased electrical components in cars, and it plans to actively respond to the growing demand.
The Samsung Exynos Auto T5123 is a 3GPP Release 15 telematics control unit that brings fast and seamless 5G connectivity in both standalone (SA) and non-standalone (NSA) mode to the next generation of connected cars.
It aims to deliver information in real-time through the high-speed download of up to 5.1Gbps. There are two Cortex-A55 CPU cores and a built-in Global Navigation Satellite System (GNSS). It supports a high-speed PCIe (PCI Express) interface and a low-power high-performance LPDDR4x mobile DRAM to process the data.
The Exynos Auto V7 is made for in-vehicle infotainment systems and features eight Cortex-A76 cores at 1.5GHz and 11 Arm Mali G76 GPU cores. There’s also NPU for services like virtual assistance that can process visual and audio data.
It supports up to four displays and 12 camera inputs and has three HiFi 4 audio processors as well. It comes with support for up to 32 GB of LPDDR4x memory capacity with high bandwidth of up to 68.3GB/s. The Exynos Auto V7 is currently in mass production and is being used in Volkswagen’s latest In-Car Application-Server (ICAS) 3.1.
Lastly, the S2VPS01 is a PMIC (Power management integrated circuits) for the Exynos Auto V9 and V7. It regulates and rectifies the flow of electrical power. The chip comprises highly efficient triple/dual-phase buck converters and integrates a low-dropout regulator (LDO) and real-time clock (RTC) within the package.
The power IC comes with various protection functions, including over-voltage protection (OVP), under-voltage protection (UVP), short circuit protection (SCP), overcurrent protection (OCP), thermal shut down (TSD), clock monitoring and output stuck checks.
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