Despite facing stringent sanctions and being placed on the US Commerce Department’s Entity List, China‘s leading memory chip manufacturer, Yangtze Memory Technologies Co (YMTC), has showcased resilience and innovation. The company, in a recent unveiling, has produced what is being hailed as the “world’s most advanced” 3D NAND memory chip by TechInsights, a notable semiconductor analysis firm.

3D NAND Memory holds potential in AI and machine learning

This significant stride by YMTC is particularly noteworthy as 3D NAND memory holds a pivotal role in high-performance computing applications, especially in artificial intelligence and machine learning. The success of YMTC‘s chip is a testament to China’s unwavering commitment to advancing its domestic semiconductor supply chain, even in the face of international challenges.

China

Interestingly, this isn’t the first time a Chinese tech entity has stunned industry insiders. The Kirin 9000S 5G processor, housed in the Huawei Mate 60 Pro smartphone, was another product that defied expectations, given the US restrictions it faced.

As of mid-December 2022, escalating trade and geopolitical tensions saw YMTC, alongside 21 other key players in China’s chip sector, added to the US Entity List. Yet, YMTC, based out of Wuhan, remained undeterred. Their focus was on dethroning memory chip giants like Samsung Electronics, SK Hynix, and Micron Technology with their flagship 3D NAND flash chip, the 232-layer X3-9070. Although mass production of this chip faced obstacles, shifts in the memory chip market dynamics and an emphasis on cost-efficiency seem to have given YMTC a leg up.

Further bolstering YMTC’s position, reports in April indicated that the company had intensified collaboration with Chinese suppliers, aiming to produce its top-tier chips using its “Xtacking 3.0” architecture. This endeavor was part of a covert project, Wudangshan, which sought to rely solely on Chinese equipment.

RELATED:

(Via)

RELATED ARTICLESMORE FROM AUTHOR