The Redmi K70 Pro, unveiled recently, has undergone a teardown by a local tech channel, revealing its impressive internal components. The teardown provides a detailed look at the phone’s components, including the camera sensors and chipsets. 

The teardown begins by removing the phone’s back panel, revealing a three-part structure. The most prominent component is the 5,000mAh battery, which supports 120W fast charging and occupies a significant portion of the phone’s interior space.

Redmi K70 Pro Teardown

The upper section houses the triple-camera setup, comprising a 50MP 1/1.55-inch primary sensor with OIS support, a 50MP telephoto unit with 2x zoom, and a 12MP ultra-wide lens. The battery and motherboard are covered by a single cover, atop which lie two large and two small heat sinks that also cover the bottom speaker.

Further inspection reveals an NFC coil, flexible printed circuit board (FPC) antennas, a flash cable, and an ambient light sensor on the motherboard cover.

The motherboard itself houses the LPDDR5X RAM and Hynix UFS 4.0 storage. The phone is powered by the Snapdragon 8 Gen 3 chip, complemented by two Xiaomi Surge P2 chips and a Qualcomm WCN7851 WiFi and Bluetooth module.

With so much more to uncover, we recommend watching the detailed video for a deeper dive into the Redmi K70 Pro’s inner workings.

To reiterate, it has a 6.67-inch 1440×3200 120 Hz OLED panel with 4,000-nit peak brightness. The display also supports 3840Hz PWM dimming, HDR10+, and Dolby Vision. The smartphone comes with Android 14 OS out of the box and is available in 3 storage configurations:

12GB + 256GB: CNY 3,299 (~$465)

16GB + 256GB: CNY 3,599 (~$508)

16GB + 512GB: CNY 3,899 (~$550)

A top-tier 24GB + 1TB configuration is also available for CNY 4,399(~$621).

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