Google‘s upcoming Pixel 9 series, and possibly the Pixel Fold 2, are expected to feature the Tensor G4 chip. The SoC is rumored to be produced by Samsung Electronics Foundry.

A recent report from the Korean publication Financial News, backed by industry sources, corroborates that Google and Samsung are collaborating on the Tensor G4.

The Tensor G4 is said to utilize Samsung’s advanced 4-nanometer process alongside FOWLP (Fan-out Wafer Level Packaging). 

Google Tensor G4

The result, the report says, will be improved thermal management, power efficiency, and performance, areas where the previous Tensor G3 reportedly fell short compared to competitors.

The report adds that the decision for Google to opt for Samsung Electronics’ 4nm process stems from the positive reception of Samsung’s Exynos 2400 chip used in the Galaxy S24 series. That means the success of the Exynos 2400 chip has certainly bolstered Samsung’s reputation as a capable semiconductor manufacturer. 

Not only Google, but also other tech industry players seem interested in alternatives to TSMC, as evidenced by visits from leaders at Open AI, TenStorrent, and Meta to Samsung Electronics.

As for the Tensor G4 SoC specs, there’s still much we don’t know. A previous leak suggested the chip might include a hardware-based ray-tracing GPU, which isn’t surprising considering Samsung has been integrating it with their Exynos processors for a few generations now.

Moreover, the rumor suggests that Google will be sticking with a tried-and-tested 3-core architecture featuring Cortex-X4, Cortex-A720, and Cortex-A520 cores. While the exact core count remains unknown, we can expect the new chip to offer better performance. We’ll keep you posted on any further updates regarding the Tensor G4 SoC.

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