Apple plans to use advanced 3D chip stacking technology in its upcoming MacBook series which is scheduled to be launched in 2025, which is said to be a breakthrough in chip packaging technology. The new packaging technology is capable of stacking multiple chips vertically making it more compact.
The industry is transitioning to glass substrates for chip packaging
However, the industry is transitioning to glass substrates to replace existing 2.5D and 3D packaging technologies. Giants like AMD, Intel, and Samsung have attracted much attention in the field of chip glass substrate supply. Samsung is actively investing resources in the research and development of glass substrates in chip manufacturing. The company reportedly has plans to use the technology in its products by 2026.
However, it is worth noting that TSMC is not absent in this field. Industry analysts have noticed signs that the company is developing similar solutions. The company is exploring new paths in the field of advanced chip packaging in an innovative way – turning to rectangular chip substrates.
According to a report, TSMC plans to switch from traditional round wafers to rectangular substrates. This move aims to improve the efficiency of the chip layout on each wafer, which significantly increases the number of chips that can be placed. Currently, this rectangular substrate is in the trial stage, with a size of 510 mm x 515 mm. It reportedly offers more than three times the usable area of traditional round wafers. Also, the rectangular design significantly reduces the waste of edge space, further improving material utilization.
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